CMP System and Method of Use

ABSTRACT

A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However, asthe minimum features sizes are reduced, additional problems arise thatshould be addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates an example of a FinFET in a three-dimensional view,in accordance with some embodiments.

FIGS. 2, 3, 4, 5, 6, 7, 8, and 9 illustrate cross-sectional views ofintermediate stages in the manufacturing of FinFETs, in accordance withsome embodiments.

FIG. 10 illustrates a plan view of a chemical mechanical planarization(CMP) system, in accordance with some embodiments.

FIGS. 11, 12, 13A, 13B, 14A, and 14B illustrate cross-sectional views ofcapacitive deionization modules (CDMs), in accordance with someembodiments.

FIG. 15 illustrates a side view of a high-rate platen/buffing platen, inaccordance with some embodiments.

FIG. 16 illustrates a side view of a tank cleaning module, in accordancewith some embodiments.

FIG. 17 illustrates a side view of a chemical mechanical cleaningmodule, in accordance with some embodiments.

FIG. 18 illustrates a side view of a brush cleaning module, inaccordance with some embodiments.

FIG. 19 illustrates a side view of a vapor dryer module, in accordancewith some embodiments.

FIGS. 20, 21A, 21B, 22A, 22B, 23A, 23B, 23C, 23D, 24A, 24B, 25A, 25B,26A, 26B, 27A, 27B, 27C, 28A, 28B, 29A, and 29B illustratecross-sectional views of intermediate stages in the manufacturing ofFinFETs, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Various embodiments provide processes and a chemical mechanicalplanarization (CMP) system used in an improved CMP process. The CMPsystem may include capacitive deionization modules (CDMs) which areconfigured to remove ions from solutions used during the CMP processes,including CMP slurries, cleaning solutions, and drying solutions. TheCDM modules may be disposed in a main polishing platen, a buffingplaten, a tank cleaning module, a chemical mechanical cleaning module, abrush cleaning module, and/or a vapor dryer module in the CMP system.The CDMs may operate in a constant voltage mode or a constant currentmode and may be configured as flow-by CDMs or flow-through CDMs. Byusing the improved CMP process wherein ions are removed from thesolutions used in the CMP system, semiconductor devices having improveddevice performance and improved device yield may be produced. Althoughthe CDMs have been described as being used in the context of a CMPsystem and process, the CDMs may be used to remove undesirable ions fromsurfaces of substrates in any processes or systems.

FIG. 1 illustrates an example of a FinFET in a three-dimensional view,in accordance with some embodiments. The FinFET comprises a fin 52 on asubstrate 50 (e.g., a semiconductor substrate). Isolation regions 56 aredisposed in the substrate 50, and the fin 52 protrudes above and frombetween neighboring isolation regions 56. Although the isolation regions56 are described/illustrated as being separate from the substrate 50, asused herein the term “substrate” may be used to refer to just thesemiconductor substrate or a semiconductor substrate inclusive ofisolation regions. Additionally, although the fin 52 and the substrate50 are illustrated as a single, continuous material, the fin 52 and/orthe substrate 50 may comprise a single material or a plurality ofmaterials. In this context, the fin 52 refers to the portion extendingbetween the neighboring isolation regions 56.

A gate dielectric layer 92 is along sidewalls and over a top surface ofthe fin 52, and a gate electrode 94 is over the gate dielectric layer92. Source/drain regions 82 are disposed in opposite sides of the fin 52with respect to the gate dielectric layer 92 and gate electrode 94. FIG.1 further illustrates reference cross-sections that are used in laterfigures. Cross-section A-A′ is along a longitudinal axis of the gateelectrode 94 and in a direction, for example, perpendicular to thedirection of current flow between the source/drain regions 82 of theFinFET. Cross-section B-B′ is perpendicular to cross-section A-A′ and isalong a longitudinal axis of the fin 52 and in a direction of, forexample, a current flow between the source/drain regions 82 of theFinFET. Cross-section C-C′ is parallel to cross-section A-A′ and extendsthrough a source/drain region of the FinFET. Subsequent figures refer tothese reference cross-sections for clarity.

Some embodiments discussed herein are discussed in the context ofFinFETs formed using a gate-last process. In other embodiments, agate-first process may be used. Also, some embodiments contemplateaspects used in planar devices, such as planar FETs.

FIGS. 2 through 9 and 20 through 29B are cross-sectional views ofintermediate stages in the manufacturing of FinFETs, in accordance withsome embodiments. FIGS. 2 through 9 and 20 illustrate referencecross-section A-A illustrated in FIG. 1, except for multiplefins/FinFETs. FIGS. 21A, 22A, 23A, 24A, 25A, 26A, 27A, 28A, and 29A areillustrated along reference cross-section A-A illustrated in FIG. 1, andFIGS. 21B, 22B, 23B, 24B, 25B, 26B, 27B, 27C, 28B, and 29B areillustrated along reference cross-section B-B illustrated in FIG. 1,except for multiple fins/FinFETs. FIGS. 23C and 23D are illustratedalong reference cross-section C-C illustrated in FIG. 1, except formultiple fins/FinFETs.

In FIG. 2, a substrate 50 is provided. The substrate 50 may be asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 50 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate is a layer of a semiconductor material formed on an insulatorlayer. The insulator layer may be, for example, a buried oxide (BOX)layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon substrate or a glasssubstrate. Other substrates, such as a multi-layered or gradientsubstrate may also be used. In some embodiments, the semiconductormaterial of the substrate 50 may include silicon; germanium; a compoundsemiconductor including silicon carbide, gallium arsenide, galliumphosphide, indium phosphide, indium arsenide, and/or indium antimonide;an alloy semiconductor including silicon-germanium, gallium arsenidephosphide, aluminum indium arsenide, aluminum gallium arsenide, galliumindium arsenide, gallium indium phosphide, and/or gallium indiumarsenide phosphide; or combinations thereof.

The substrate 50 has a region 50N and a region 50P. The region 50N canbe for forming n-type devices, such as NMOS transistors, e.g., n-typeFinFETs. The region 50P can be for forming p-type devices, such as PMOStransistors, e.g., p-type FinFETs. The region 50N may be physicallyseparated from the region 50P (as illustrated by divider 51), and anynumber of device features (e.g., other active devices, doped regions,isolation structures, etc.) may be disposed between the region 50N andthe region 50P.

In FIG. 3, fins 52 are formed in the substrate 50. The fins 52 aresemiconductor strips. In some embodiments, the fins 52 may be formed inthe substrate 50 by etching trenches in the substrate 50. The etchingmay be any acceptable etch process, such as a reactive ion etch (RIE),neutral beam etch (NBE), the like, or a combination thereof. The etchingmay be anisotropic.

The fins may be patterned by any suitable method. For example, the finsmay be patterned using one or more photolithography processes, includingdouble-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used to pattern thefins. In some embodiments, the mask (or other layer) may remain on thefins 52.

In FIG. 4, an insulation material 54 is formed over the substrate 50 andbetween neighboring fins 52. The insulation material 54 may be an oxide,such as silicon oxide, a nitride, the like, or a combination thereof,and may be formed by a high density plasma chemical vapor deposition(HDP-CVD), a flowable CVD (FCVD) (e.g., a CVD-based material depositionin a remote plasma system and post curing to make it convert to anothermaterial, such as an oxide), the like, or a combination thereof. Otherinsulation materials formed by any acceptable process may be used. Inthe illustrated embodiment, the insulation material 54 is silicon oxideformed by a FCVD process. An anneal process may be performed once theinsulation material is formed. In an embodiment, the insulation material54 is formed such that excess insulation material 54 covers the fins 52.Although the insulation material 54 is illustrated as a single layer,some embodiments may utilize multiple layers. For example, in someembodiments a liner (not shown) may first be formed along a surface ofthe substrate 50 and the fins 52. Thereafter, a fill material, such asthose discussed above may be formed over the liner.

In FIG. 5, a removal process is applied to the insulation material 54 toremove excess insulation material 54 over the fins 52. In someembodiments, a planarization process such as a chemical mechanicalpolish (CMP), an etch-back process, combinations thereof, or the likemay be utilized. The planarization process exposes the fins 52 such thattop surfaces of the fins 52 and the insulation material 54 are levelafter the planarization process is complete. In embodiments in which amask remains on the fins 52, the planarization process may expose themask or remove the mask such that top surfaces of the mask or the fins52, respectively, and the insulation material 54 are level after theplanarization process is complete.

In FIG. 6, the insulation material 54 is recessed to form shallow trenchisolation (STI) regions 56. The insulation material 54 is recessed suchthat upper portions of fins 52 in the region 50N and in the region 50Pprotrude from between neighboring STI regions 56. Further, the topsurfaces of the STI regions 56 may have a flat surface as illustrated, aconvex surface, a concave surface (such as dishing), or a combinationthereof. The top surfaces of the STI regions 56 may be formed flat,convex, and/or concave by an appropriate etch. The STI regions 56 may berecessed using an acceptable etching process, such as one that isselective to the material of the insulation material 54 (e.g., etchesthe material of the insulation material 54 at a faster rate than thematerial of the fins 52). For example, an oxide removal using, forexample, dilute hydrofluoric (dHF) acid may be used.

The process described with respect to FIGS. 2 through 6 is just oneexample of how the fins 52 may be formed. In some embodiments, the finsmay be formed by an epitaxial growth process. For example, a dielectriclayer can be formed over a top surface of the substrate 50, and trenchescan be etched through the dielectric layer to expose the underlyingsubstrate 50. Homoepitaxial structures can be epitaxially grown in thetrenches, and the dielectric layer can be recessed such that thehomoepitaxial structures protrude from the dielectric layer to formfins. Additionally, in some embodiments, heteroepitaxial structures canbe used for the fins 52. For example, the fins 52 in FIG. 5 can berecessed, and a material different from the fins 52 may be epitaxiallygrown over the recessed fins 52. In such embodiments, the fins 52comprise the recessed material as well as the epitaxially grown materialdisposed over the recessed material. In an even further embodiment, adielectric layer can be formed over a top surface of the substrate 50,and trenches can be etched through the dielectric layer. Heteroepitaxialstructures can then be epitaxially grown in the trenches using amaterial different from the substrate 50, and the dielectric layer canbe recessed such that the heteroepitaxial structures protrude from thedielectric layer to form the fins 52. In some embodiments wherehomoepitaxial or heteroepitaxial structures are epitaxially grown, theepitaxially grown materials may be in situ doped during growth, whichmay obviate prior and subsequent implantations although in situ andimplantation doping may be used together.

Still further, it may be advantageous to epitaxially grow a material inregion 50N (e.g., an NMOS region) different from the material in region50P (e.g., a PMOS region). In various embodiments, upper portions of thefins 52 may be formed from silicon-germanium (Si_(x)Ge_(1-x), where xcan be in the range of 0 to 1), silicon carbide, pure or substantiallypure germanium, a III-V compound semiconductor, a II-VI compoundsemiconductor, or the like. For example, the available materials forforming III-V compound semiconductor include, but are not limited to,indium arsenide, aluminum arsenide, gallium arsenide, indium phosphide,gallium nitride, indium gallium arsenide, indium aluminum arsenide,gallium antimonide, aluminum antimonide, aluminum phosphide, galliumphosphide, and the like.

Further in FIG. 6, appropriate wells (not separately illustrated) may beformed in the fins 52 and/or the substrate 50. In some embodiments, a Pwell may be formed in the region 50N, and an N well may be formed in theregion 50P. In some embodiments, a P well or an N well are formed inboth the region 50N and the region 50P.

In the embodiments with different well types, the different implantsteps for the region 50N and the region 50P may be achieved using aphotoresist or other masks (not separately illustrated). For example, aphotoresist may be formed over the fins 52 and the STI regions 56 in theregion 50N. The photoresist is patterned to expose the region 50P of thesubstrate 50, such as a PMOS region. The photoresist can be formed byusing a spin-on technique and can be patterned using acceptablephotolithography techniques. Once the photoresist is patterned, ann-type impurity implant is performed in the region 50P, and thephotoresist may act as a mask to substantially prevent n-type impuritiesfrom being implanted into the region 50N, such as an NMOS region. Then-type impurities may be phosphorus, arsenic, antimony, or the likeimplanted in the region to a concentration of equal to or less than 10¹⁸cm⁻³, such as between about 10¹⁶ cm⁻³ and about 10¹⁸ cm⁻³. After theimplant, the photoresist is removed, such as by an acceptable ashingprocess.

Following the implanting of the region 50P, a photoresist is formed overthe fins 52 and the STI regions 56 in the region 50P. The photoresist ispatterned to expose the region 50N of the substrate 50, such as the NMOSregion. The photoresist can be formed by using a spin-on technique andcan be patterned using acceptable photolithography techniques. Once thephotoresist is patterned, a p-type impurity implant may be performed inthe region 50N, and the photoresist may act as a mask to substantiallyprevent p-type impurities from being implanted into the region 50P, suchas the PMOS region. The p-type impurities may be boron, boron fluoride,indium, or the like implanted in the region to a concentration of equalto or less than 10¹⁸ cm⁻³, such as between about 10¹⁶ cm⁻³ and about10¹⁸ cm⁻³. After the implant, the photoresist may be removed, such as byan acceptable ashing process.

After the implants of the region 50N and the region 50P, an anneal maybe performed to repair implant damage and to activate the p-type and/orn-type impurities that were implanted. In some embodiments, the grownmaterials of epitaxial fins may be in situ doped during growth, whichmay obviate the implantations, although in situ and implantation dopingmay be used together.

In FIG. 7, a first dummy dielectric layer 60 is formed on the fins 52.The first dummy dielectric layer 60 may be, for example, silicon oxide,silicon nitride, a combination thereof, or the like, and may bedeposited or thermally grown according to acceptable techniques. A dummygate layer 62 is formed over the first dummy dielectric layer 60, asecond dummy dielectric layer 66 is formed over the dummy gate layer 62,and a sacrificial layer 68 is formed over the second dummy dielectriclayer 66. The dummy gate layer 62 may be a conductive or non-conductivematerial and may be selected from a group including amorphous silicon,polycrystalline-silicon (polysilicon), poly-crystallinesilicon-germanium (poly-SiGe), metallic nitrides, metallic silicides,metallic oxides, and metals. The second dummy dielectric layer 66 maybe, for example, silicon oxide, silicon nitride, a combination thereof,or the like, and may be deposited or thermally grown according toacceptable techniques. The sacrificial layer 68 may be a conductive ornon-conductive material and may be selected from a group includingamorphous silicon, polycrystalline-silicon (polysilicon),poly-crystalline silicon-germanium (poly-SiGe), metallic nitrides,metallic silicides, metallic oxides, and metals. In some embodiments,the dummy gate layer 62 and the sacrificial layer 68 may be formed ofpolysilicon and the second dummy dielectric layer 66 may be formed ofsilicon nitride.

The dummy gate layer 62 and the sacrificial layer 68 may be deposited byphysical vapor deposition (PVD), CVD, sputter deposition, or othertechniques known and used in the art for depositing the selectedmaterial. The dummy gate layer 62 may be made of other materials thathave a high etching selectivity from the etching of the STI regions 56.It is noted that the first dummy dielectric layer 60 is shown coveringonly the fins 52 for illustrative purposes only. In some embodiments,the first dummy dielectric layer 60 may be deposited such that the firstdummy dielectric layer 60 covers the STI regions 56, extending betweenthe dummy gate layer 62 and the STI regions 56.

The second dummy dielectric layer 66 and the sacrificial layer 68 may beformed over the dummy gate layer 62 to improve the planarizationefficiency of the dummy gate layer 62. In embodiments in which the fins52 protrude above the STI regions 56 by a distance from about 10 nm toabout 50 nm, such as about 30 nm, the first dummy dielectric layer 60may have a thickness from about 1 nm to about 5 nm, such as about 3 nm;the dummy gate layer 62 may have a thickness from about 150 nm to about250 nm, such as about 200 nm; the second dummy dielectric layer 66 mayhave a thickness from about 5 nm to about 25 nm, such as about 15 nm;and the sacrificial layer 68 may have a thickness from about 150 nm toabout 250 nm, such as about 200 nm.

In FIG. 8, a planarization process, such as a CMP is performed on thesacrificial layer 68 and the second dummy dielectric layer 66 to removethe sacrificial layer 68 and expose and planarize a top surface of thesecond dummy dielectric layer 66. As will be discussed below inreference to FIG. 10, a CMP system 200 may be used to planarize thesacrificial layer 68 and the second dummy dielectric layer 66.

In FIG. 9, the second dummy dielectric layer 66 and the dummy gate layer62 are etched back to expose a planar top surface of the dummy gatelayer 62. A wet clean process, such as a Standard Clean-1 process, aStandard Clean-2 process, combinations thereof, or the like may beperformed on the second dummy dielectric layer 66 prior to the seconddummy dielectric layer 66 and the dummy gate layer 62 being etched backin order to remove fall-on particles and the like.

Various processes performed by the CMP system 200 in planarizing thesacrificial layer 68 and the dummy dielectric layer 66 may deposit ions,such as metallic ions, on the surface of the second dummy dielectriclayer 66 prior to the etch-back of the second dummy dielectric layer 66and the dummy gate layer 62. For example, the ions may be deposited onthe surface of the second dummy dielectric layer 66 from a CMP slurryused by the CMP system 200, from another solution used by the CMP system200, from a polishing pad used by the CMP system 200, or the like. Theions may be deposited anywhere on the surface of the second dummydielectric layer 66. The ions may mask portions of the second dummydielectric layer 66 during the etch-back such that the masked portionsof the second dummy dielectric layer 66 are not etched during theetch-back, causing humps to be formed at the top surface of the dummygate layer 62. The humps may cause defects in resulting semiconductordevices which reduce device performance and wafer yield. As such, it isdesirable to prevent the ions from being deposited on the second dummydielectric layer 66 during the CMP by the CMP system 200. A wet cleanprocess, such as a Standard Clean-1 process, a Standard Clean-2 process,combinations thereof, or the like may be performed on the dummy gatelayer 62 after the second dummy dielectric layer 66 and the dummy gatelayer 62 are etched back in order to remove fall-on particles and thelike.

FIG. 10 illustrates a CMP system 200 which may be used to planarize thesacrificial layer 68 and the second dummy dielectric layer 66 disposedon the substrate 50. The CMP system 200 may include loadlocks 202, atransportation unit 204, a polishing unit 206, and a cleaning station208. The loadlocks 202 may be used for loading substrates into the CMPsystem 200 and unloading substrates from the CMP system 200 once thesubstrates have been processed by the CMP system 200. The transportationunit 204 may be used to transport the wafers between the loadlocks 202,the polishing unit 206, and the cleaning station 208. The polishing unit206 may include one or more CMP polishing platens, such as a high-rateplaten 210 and a buffing platen 212. The high-rate platen 210 may beused for polishing and removing material from the substrates with arelatively high polishing rate, such as a bulk polishing rate, while thebuffing platen 212 may be used for polishing and removing material fromthe substrates with a slower polishing rate and also to fix defects andscratches that may occur during the high-rate removal. The cleaningstation 208 may include one or more cleaning modules, such as a tankcleaning module 214, a chemical mechanical cleaning (CMC) module 216, abrush cleaning module 218, and a vapor dryer module 220. The variousmodules of the cleaning station 208 may be used to remove contaminantsremaining on the surfaces of the substrates following the CMP processesperformed by the polishing unit 206, such as particulate, organic, andmetallic contaminants.

Various solutions, such as deionized (DI) water, CMP slurry, isopropylalcohol (IPA), other chemicals, and the like (collectively referred toas the solution) may be used throughout the processes performed by theCMP system 200. Ions, such as metallic ions which may include nickel(Ni), iron (Fe), aluminum (Al), and the like may be present in thesolution and may be deposited on the substrate, such as on a top surfaceof the second dummy dielectric layer 66 during the processes performedby the CMP system 200. The ions may be present in the solution when fedto the CMP system 200, or may be deposited in the solution during theprocesses performed by the CMP system 200. For example, the ions may bedeposited in the solution from polishing pads used in the polishing unit206. The ions may act as masks during the etch-back process used to etchback, for example, the second dummy dielectric layer 66 and the dummygate layer 62, which may result in undesirable humps being formed on thesurface of the dummy gate layer 62. As such, it is desirable to removethe ions from the solution such that the ions are not deposited on thesubstrates and to remove any deposited ions from the substrates.

FIG. 11 illustrates a flow-by capacitive deionization module (CDM) 300,which may be included in the polishing platens of the polishing unit 206and/or the cleaning modules of the cleaning station 208 and may be usedto remove the ions from the solution and/or the substrates. The flow-byCDM 300 is compatible with current CMP systems. The flow-by CDM 300 maybe placed anywhere in a CMP system that ions are present in order toremove the ions. FIGS. 15-19 illustrate various positions in the CMPsystem 200 in which CDMs such as the flow-by CDM 300 may be placed;however, the flow-by CDM 300 may be placed in any desired position in aCMP system. The flow-by CDM 300 includes a first electrode 302, a firstcurrent collector 304, a second electrode 306, and a second currentcollector 308. The first electrode 302 and the second electrode 306 maybe formed of a porous material that allows the ions to be removed fromthe solution and stored therein. For example, the first electrode 302and the second electrode 306 may be formed of activated carbon,mesoporous carbon, carbon aerogels, carbide-derived carbons, carbonnanotubes, graphene, carbon black, or the like.

The first electrode 302 or the second electrode 306 may be positivelycharged (e.g., an anode) and the other of the first electrode 302 or thesecond electrode 306 may be negatively charged (e.g., a cathode).Positively charged ions (e.g., cations) may be removed from the solutionand stored in the cathode and negatively charged ions (e.g., anions) maybe removed from the solution and stored in the anode. A potentialdifference may be applied between the first current collector 304 andthe second current collector 308 in order to charge the first electrode302 and the second electrode 306. Electrical signals such as voltagedrop, current change, and the like between the first electrode 302 andthe second electrode 306 may be monitored in order to monitor the lifetime of the flow-by CDM 300. The electrical signals may be used todetermine when to switch from an adsorption phase to a desorption phase(discussed in greater detail with respect to FIGS. 13A and 13B) in orderto regenerate the first electrode 302 and the second electrode 306.

As illustrated in FIG. 11, in the flow-by CDM 300, the first electrode302 and the second electrode 306 may be separated by a distance D1. Thedistance D1 may be from about 0.01 cm to about 50 cm, such as about 1cm. As indicated by arrows 310, the solution may flow through andbetween the first electrode 302 and the second electrode 306 in adirection parallel to major surfaces of the first electrode 302 and thesecond electrode 306.

The flow-by CDM 300 may be operated in a constant voltage mode or aconstant current mode. In the constant voltage mode, a constant voltageis applied between the first electrode 302 and the second electrode 306.As ions are absorbed in the first electrode 302 and the second electrode306, the potential difference between the first electrode 302 and thesecond electrode 306 decreases, and the rate at which ions are absorbedin the first electrode 302 and the second electrode 306 decreases. Assuch, the concentration of the ions in the solution may increase overtime. The flow-by CDM 300 may be operated with a voltage having anabsolute value from about 0 V and about 50 V, such as about 25 V in theconstant voltage mode. A relatively low voltage may be used for theflow-by CDM 300 as compared with other methods for removing ions from asolution, resulting in power savings.

In the constant current mode, a constant current is applied between thefirst electrode 302 and the second electrode 306. In the constantcurrent mode, ions are absorbed in the first electrode 302 and thesecond electrode 306 at a substantially constant rate over time and theconcentration of ions in the effluent solution is constant. The voltageapplied between the first electrode 302 and the second electrode 306 isincreased over time in the constant current mode. The flow-by CDM 300may operate with a current having an absolute value from about 0 A andabout 30 A, such as about 15 A in the constant current mode.

FIG. 12 illustrates a flow-through CDM 400, which may be included in thepolishing platens of the polishing unit 206 and/or the cleaning modulesof the cleaning station 208 and may be used to remove the ions from thesolution and/or the substrates. The flow-through CDM 400 is compatiblewith current CMP systems. The flow-through CDM 400 may be placedanywhere in a CMP system that ions are present in order to remove theions. FIGS. 15-19 illustrate various positions in the CMP system 200 inwhich CDMs such as the flow-through CDM 400 may be placed; however, theflow-through CDM 400 may be placed in any desired position in a CMPsystem. The flow-through CDM 400 includes a third electrode 402, a thirdcurrent collector 404, a fourth electrode 406, a fourth currentcollector 408, and a spacer 405 separating the third electrode 402 fromthe fourth electrode 406. The third electrode 402 and the fourthelectrode 406 may be formed of porous materials that allow the ions tobe removed from the solution and stored therein. For example, the thirdelectrode 402 and the fourth electrode 406 may be formed of activatedcarbon, mesoporous carbon, carbon aerogels, carbide-derived carbons,carbon nanotubes, graphene, carbon black, or the like. The spacer 405may also be formed of a porous material that allows for the solution toflow through the spacer 405.

The third electrode 402 or the fourth electrode 406 may be positivelycharged (e.g., an anode) and the other of the third electrode 402 or thefourth electrode 406 may be negatively charged (e.g., a cathode).Positively charged ions (e.g., cations) may be removed from the solutionand stored in the cathode and negatively charged ions (e.g., anions) maybe removed from the solution and stored in the anode. A potentialdifference may be applied between the third current collector 404 andthe fourth current collector 408 in order to charge the third electrode402 and the fourth electrode 406. Electrical signals such as voltagedrop, current change, and the like between the third electrode 402 andthe fourth electrode 406 may be monitored in order to monitor the lifetime of the flow-through CDM 400. The electrical signals may be used todetermine when to switch from an adsorption phase to a desorption phase(discussed in greater detail with respect to FIGS. 14A and 14B) in orderto regenerate the third electrode 402 and the fourth electrode 406.

As illustrated in FIG. 12, in the flow-through CDM 400, the thirdelectrode 402 is in contact with the fourth electrode 406. Theflow-through CDM 400 includes inlets 410 and outlets 412. In theflow-through CDM 400, the solution flows from the inlets 410, throughthe third electrode 402 and the fourth electrode 406, and out of theoutlets 412 in a direction perpendicular to major surfaces of the thirdelectrode 402 and the fourth electrode 406. The flow-through CDM 400 mayoperate in a constant voltage mode (e.g., operated at a constant voltagefrom about 0 V and about 50 V, such as about 25 V) or a constant currentmode (e.g., operated at a constant current from about 0 A and about 30A, such as about 15 A) similar to the flow-by CDM 300. A relatively lowvoltage may be used for the flow-through CDM 400 as compared with othermethods for removing ions from a solution, resulting in power savings.

FIGS. 13A and 13B illustrate an adsorption phase and a desorption phase,respectively, for the flow-by CDM 300. During the adsorption phase,illustrated in FIG. 13A, a potential difference is applied between thefirst electrode 302 and the second electrode 306 and anions 314 andcations 312 present in the solution are collected in the first electrode302 and the second electrode 306. The negatively charged anions 314 arecollected in the positively charged anode (e.g., the second electrode306 in the embodiment illustrated in FIGS. 13A and 13B) and thepositively charged cations 312 are collected in the negatively chargedcathode (e.g., the first electrode 302 in the embodiment illustrated inFIGS. 13A and 13B).

During the desorption phase, illustrated in FIG. 13B, the potentialdifference between the first electrode 302 and the second electrode 306is reversed or reduced to zero. The anions 314 and the cations 312collected in the first electrode 302 and the second electrode 306 arereleased into the solution during the desorption phase and the firstelectrode 302 and the second electrode 306 are thereby regenerated. Theflow-by CDM 300 may regenerated in the desorption phase with solutionthat is not to be used in processing the substrates in the CMP system200. Electrical signals from the first electrode 302 and the secondelectrode 306 such as voltage drop, current change, or the like may bemonitored in order to determine when to alternate the flow-by CDM 300between the adsorption phase and the desorption phase.

FIGS. 14A and 14B illustrate an adsorption phase and a desorption phase,respectively, for the flow-through CDM 400. During the adsorption phase,illustrated in FIG. 14A, a potential difference is applied between thethird electrode 402 and the fourth electrode 406 and anions 416 andcations 414 present in the solution are collected in the third electrode402 and the fourth electrode 406. The negatively charged anions 416 passthrough the negatively charged cathode (e.g., the third electrode 402 inthe embodiment illustrated in FIGS. 14A and 14B) and are collected inthe positively charged anode (e.g., the fourth electrode 406 in theembodiment illustrated in FIGS. 14A and 14B) and the positively chargedcations 414 are collected in the negatively charged cathode.

During the desorption phase, illustrated in FIG. 14B, the potentialdifference between the third electrode 402 and the fourth electrode 406is reduced to zero. The anions 416 and the cations 414 collected in thethird electrode 402 and the fourth electrode 406 are released into thesolution during the desorption phase and the third electrode 402 and thefourth electrode 406 are thereby regenerated. The flow-through CDM 400may regenerated in the desorption phase with solution that is not to beused in processing the substrates in the CMP system 200. Electricalsignals from the third electrode 402 and the fourth electrode 406 suchas voltage drop, current change, or the like may be monitored in orderto determine when to alternate the flow-through CDM 400 between theadsorption phase and the desorption phase.

FIG. 15 illustrates a high-rate platen 210/a buffing platen 212 whichmay be used to planarize the substrate 50. The buffing platen 212 mayinclude similar components and operate in a manner similar to thehigh-rate platen 210, therefore the buffing platen 212 has not beenseparately illustrated. Differences (if any) in the structures of thehigh-rate platen 210 and the buffing platen 212 are described in thedescription of FIG. 15. In an embodiment, the substrate 50, includingthe second dummy dielectric layer 66 and the sacrificial layer 68 may beloaded into the CMP system 200 through the loadlocks 202 and passed tothe high-rate platen 210 for a removal of the material of the seconddummy dielectric layer 66 and the sacrificial layer 68. Once at thehigh-rate platen 210 (as illustrated in FIG. 15), the substrate 50 maybe connected to a first carrier 502, which faces the substrate 50 andthe sacrificial layer 68 towards a first polishing pad 504 connected toa platform 512. As illustrated in FIG. 15, the substrate 50 may be heldhorizontally on the first polishing pad 504.

The first polishing pad 504 may be a hard polishing pad that may beutilized for a relatively quick removal of the material of thesacrificial layer 68 and the second dummy dielectric layer 66. Thebuffing platen 212 may include a polishing pad having a lower hardnessthan the first polishing pad 504. The polishing pad of the buffingplaten 212 may have a slower polishing rate and be utilized to fixdefects and scratches that may occur during the high-rate removal of thefirst polishing pad 504. During the CMP process the first carrier 502may press the surface of the sacrificial layer 68 against the firstpolishing pad 504. The substrate 50 and the first polishing pad 504 areeach rotated against each other, either in the same direction or elsecounter-rotated in opposite directions. By rotating the first polishingpad 504 and the substrate 50 against each other, the first polishing pad504 mechanically grinds away the material of the sacrificial layer 68and the second dummy dielectric layer 66, thereby effectuating a removalof the material of the sacrificial layer 68 and the second dummydielectric layer 66. Additionally, in some embodiments the first carrier502 may move the substrate 50 back and forth along a radius of the firstpolishing pad 504.

Additionally, the mechanical grinding of the first polishing pad 504 maybe assisted by use of a CMP slurry 506, which may be dispensed onto thefirst polishing pad 504 through a slurry dispensing system 508. Theslurry dispensing system 508 may include a CDM 510 which may be disposedupstream of a nozzle 509 of the slurry dispensing system 508 or thelike. The CDM 510 may be a flow-by CDM (e.g., a flow-by CDM 300), aflow-through CDM (e.g., a flow-through CDM 400), or a CDM having anyother configuration and may operate in the constant voltage mode, theconstant current mode, or the like. The CDM 510 may remove ions from theCMP slurry 506 prior to the CMP slurry 506 coming into contact with thesubstrate 50 so that the ions are prevented from being deposited on thesecond dummy dielectric layer 66.

An additional CDM 510 may be placed on the surface of the firstpolishing pad 504. The CDM 510 may be placed a distance from the centerof the first polishing pad 504, such as from 2 cm to 36 cm from thecenter of the first polishing pad 504. The CDM 510 may be disposedparallel to an edge of the first polishing pad 504, aligned with aradius of the first polishing pad 504, or the like. Multiple CDMs 510may be placed on the surface of the first polishing pad 504. The CDM 510disposed on the surface of the first polishing pad 504 may remove ionsfrom the CMP slurry 506 which are present when the CMP slurry 506 isdeposited and ions that the CMP slurry 506 picks up from the polishingpad 504 or the like. The CDM 510 on the surface of the first polishingpad 504 may remove ions from the CMP slurry 506 before and after the CMPslurry 506 contacts the substrate 50 and may prevent ions from beingdeposited on the second dummy dielectric layer 66.

Following the CMP process, the CMP slurry 506 may be removed from thetop surface of the substrate 50. For example, the CMP slurry 506 may beremoved from the surface of the substrate 50 by ceasing dispensing ofthe CMP slurry 506 from the slurry dispensing system 508 while the firstcarrier 502 continues to rotate the substrate 50, such that thecentrifugal force will cause the CMP slurry 506 to be removed from thesurface of the substrate 50.

FIG. 16 illustrates a tank cleaning module 214 which may be utilized toremove contaminants remaining on the surface of the substrate 50following the planarization by the high-rate platen 210 and the buffingplaten 212. The tank cleaning module 214 includes a main tank 602, anoverflow tank 604, a transducer 606, an inlet 608, an outlet 610, waferholders 612, and a CDM 614. As illustrated by the arrows 616, cleaningsolution may enter the main tank 602 through the inlet 608, usedcleaning solution may overflow the main tank 602 to the overflow tank604, and the used cleaning solution may exit the outlet 610.Contaminants removed from the surfaces of the substrate 50 may rise tothe top of the cleaning solution and be transported into the overflowtank 605. The transducer 606 may be a megasonic transducer or anultrasonic transducer and may generate an acoustic field at a frequencyfrom about 0.8 MHz to about 2 MHz, from about 20 kHz to about 200 kHz,or the like. The acoustic field generated by the transducer 606 causescavitation, which aids in cleaning the substrate 50. The wafer holders612 may hold the substrate 50 in the main tank 602 and may includerollers that rotate the substrate 50. Although the substrate 50 isillustrated as being held vertically in the main tank 602 by the waferholders 612, in some embodiments the wafer holders 612 may hold thesubstrate 50 horizontally in the main tank 602. The cleaning solutionmay be any solution for cleaning semiconductor substrates and mayinclude DI water, hydrochloric acid (HCl), hydrogen peroxide (H₂O₂),ammonia (NH₃), hydrofluoric acid (HF), any other weak or strong acid,any other weak or strong base, combinations thereof, or the like.

The CDM 614 may be a flow-by CDM (e.g., a flow-by CDM 300), aflow-through CDM (e.g., a flow-through CDM 400), or a CDM having anyother configuration and may operate in the constant voltage mode, theconstant current mode, or the like. The CDM 614 may remove ions from thecleaning solution present in the main tank 602 such that the ions areremoved from the second dummy dielectric layer 66. As illustrated inFIG. 16, the CDM 614 may be disposed in the main tank 602. Although onlyone CDM 614 is illustrated in FIG. 16, multiple CDMs 614 may be disposedin the main tank 602. The CDMs 614 may be submerged in the cleaningsolution present in the main tank 602. In some embodiments, CDMs 614 maybe disposed at the inlet 608, at the outlet 610, or the like.

FIG. 17 illustrates a CMC module 216 which may be utilized to removecontaminants remaining on the surface of the substrate 50 following thecleaning performed by the tank cleaning module 214. The CMC module 216includes wafer holders 702, a swing arm 704, a buff pad 706, a spray bar708, and a nozzle 710. The wafer holder 702 holds the substrate 50 andmay include rollers that rotate the substrate 50. The swing arm 704moves the buff pad 706 over the surface of the substrate 50. The buffpad 706 is configured to clean the surface of the substrate 50 and mayrotate in a direction parallel to a major surface of the substrate 50.The buff pad 706 and the substrate 50 may rotate in the same directionor opposite directions. The substrate 50 may be held vertically in theCMC module 216.

The nozzle 710 and the spray bar 708 may each be configured to spray acleaning solution onto the surface of the substrate 50. The cleaningsolution may be any solution for cleaning semiconductor substrates andmay include DI water, hydrochloric acid (HCl), hydrogen peroxide (H₂O₂),ammonia (NH₃), hydrofluoric acid (HF), any other weak or strong acid,any other weak or strong base, combinations thereof, or the like. Insome embodiments, the nozzle 710 may be configured to spray a cleaningsolution configured to remove particulates from the surface of thesubstrate 50 onto the substrate 50 and the spray bar 708 may beconfigured to spray DI water onto the substrate 50 to rinse thesubstrate 50.

CDMs 712 may be included in the nozzle 710 and the spray bar 708 inorder to remove ions from the cleaning solution sprayed from the nozzle710 and the spray bar 708. As illustrated in FIG. 17, the CDMs 712 maybe placed upstream of the nozzles in the spray bar 708, upstream of thenozzle 710, or the like. The CDMs 712 may be flow-by CDMs (e.g., flow-byCDMs 300), flow-through CDMs (e.g., flow-through CDMs 400), or CDMshaving any other configuration and may operate in the constant voltagemode, the constant current mode, or the like. The CDMs 712 may preventions present in the cleaning solution from being deposited on thesubstrate 50.

FIG. 18 illustrates a brush cleaning module 218 which may be utilized toremove contaminants remaining on the surface of the substrate 50following the cleaning performed by the CMC module 216. The brushcleaning module 218 may include brushes 802, a wafer holder 804, andnozzles 806. The wafer holder 804 holds the substrate 50 and may includerollers that rotate the substrate 50. The wafer holder 804 may rotatethe substrate 50 in a direction parallel to major surfaces of thesubstrate 50, as illustrated by the arrow 808. As illustrated in FIG.18, the brushes 802 may be disposed on either side of the substrate 50.The brushes 802 may be brush rollers and have a generally cylindricalshape. The brushes 802 may be formed of a material such as polyvinylalcohol or the like. The brushes 802 may rotate on their own axes indirections illustrated by the arrows 810. The brushes 802 disposed onopposite sides of the substrate 50 may rotate in the same direction oropposite directions.

The nozzles 806 may spray a cleaning solution at the substrate 50 whilethe substrate 50 is cleaned by the brushes 802. The cleaning solutionmay be any solution for cleaning semiconductor substrates and mayinclude DI water, hydrochloric acid (HCl), hydrogen peroxide (H₂O₂),ammonia (NH₃), hydrofluoric acid (HF), any other weak or strong acid,any other weak or strong base, combinations thereof, or the like. Thenozzles 806 may include CDMs 812, which may remove ions from thecleaning solution sprayed from the nozzles 806. As illustrated in FIG.18, the CDMs 812 may be placed upstream of the nozzles 806. The CDMs 812may be flow-by CDMs (e.g., flow-by CDMs 300), flow-through CDMs (e.g.,flow-through CDMs 400), or CDMs having any other configuration and mayoperate in the constant voltage mode, the constant current mode, or thelike. The CDMs 812 may prevent ions present in the cleaning solutionfrom being deposited on the substrate 50.

FIG. 19 illustrates a vapor dryer module 220 used to rinse and dry thesubstrate 50 after the substrate is cleaned by the brush cleaning module218. The vapor dryer module 220 includes wafer holders 902 and a nozzle904. The wafer holders 902 may hold the substrate 50 horizontally orvertically and may rotate the wafer in a direction parallel to majorsurfaces of the substrate 50. The nozzle 904 may be used to spray dryingsolutions 906 onto the substrate 50 to rinse and dry the substrate 50.The nozzle 904 may spray DI water onto the substrate 50, followed byisopropyl alcohol and may take advantage of the Marangoni effect to drythe substrate 50.

The nozzles 904 may include CDMs 908, which may remove ions from thedrying solutions 906 sprayed from the nozzles 904. As illustrated inFIG. 19, the CDMs 908 may be placed upstream of the nozzles 904. TheCDMs 908 may be flow-by CDMs (e.g., flow-by CDMs 300), flow-through CDMs(e.g., flow-through CDMs 400), or CDMs having any other configurationand may operate in the constant voltage mode, the constant current mode,or the like. The CDMs 908 may prevent ions present in the dryingsolutions 906 from being deposited on the substrate 50.

Although the cleaning process performed by the cleaning station 208 hasbeen described as proceeding from the tank cleaning module 214 to theCMC module 216 to the brush cleaning module 218, any number of cleaningmodules may be included and the substrate 50 may proceed through thecleaning modules in any order to remove contaminants from the substrate50. Including the various CDMs in the modules of the cleaning station208 and the CMP polishing platens of the polishing unit 206 allows forions to be removed from the various solutions which interact with thesubstrate 50 and prevents the ions from being deposited on the surfaceof the second dummy dielectric layer 66. This prevents the ions frommasking the second dummy dielectric layer 66 during the etch-backprocess described in relation to FIG. 9, which prevents defects such ashumps being formed in the surface of the dummy gate layer 62. As such,device performance and device yield are both increased.

In FIG. 20, a mask layer 64 is formed on the dummy gate layer 62. Themask layer 64 may include, for example, silicon nitride, siliconoxynitride, tetraethyl orthosilicate (TEOS), combinations or multiplelayers thereof, or the like. In this example, a single dummy gate layer62 and a single mask layer 64 are formed across the region 50N and theregion 50P. A wet clean process, such as a Standard Clean-1 process, aStandard Clean-2 process, combinations thereof, or the like may beperformed on the mask layer 64 after depositing the mask layer 64 inorder to remove fall-on particles and the like.

FIGS. 21A through 29B illustrate various additional steps in themanufacturing of embodiment devices. FIGS. 21A through 29B illustratefeatures in either of the region 50N and the region 50P. For example,the structures illustrated in FIGS. 21A through 29B may be applicable toboth the region 50N and the region 50P. Differences (if any) in thestructures of the region 50N and the region 50P are described in thetext accompanying each figure.

In FIGS. 21A and 21B, the mask layer 64 (see FIG. 20) may be patternedusing acceptable photolithography and etching techniques to form masks74. The pattern of the masks 74 then may be transferred to the dummygate layer 62. In some embodiments (not separately illustrated), thepattern of the masks 74 may also be transferred to the first dummydielectric layer 60 by an acceptable etching technique to form dummygates 72. The dummy gates 72 cover respective channel regions 58 of thefins 52. The pattern of the masks 74 may be used to physically separateeach of the dummy gates 72 from adjacent dummy gates. The dummy gates 72may also have a lengthwise direction substantially perpendicular to thelengthwise direction of respective epitaxial fins 52.

Further in FIGS. 21A and 21B, gate seal spacers 80 can be formed onexposed surfaces of the dummy gates 72, the masks 74, and/or the fins52. A thermal oxidation or a deposition followed by an anisotropic etchmay form the gate seal spacers 80. The gate seal spacers 80 may beformed of silicon oxide, silicon nitride, silicon oxynitride, or thelike.

After the formation of the gate seal spacers 80, implants for lightlydoped source/drain (LDD) regions (not explicitly illustrated) may beperformed. In the embodiments with different device types, similar tothe implants discussed above in FIG. 6, a mask, such as a photoresist,may be formed over the region 50N, while exposing the region 50P, andappropriate type (e.g., p-type) impurities may be implanted into theexposed fins 52 in the region 50P. The mask may then be removed.Subsequently, a mask, such as a photoresist, may be formed over theregion 50P while exposing the region 50N, and appropriate typeimpurities (e.g., n-type) may be implanted into the exposed fins 52 inthe region 50N. The mask may then be removed. The n-type impurities maybe any of the n-type impurities previously discussed, and the p-typeimpurities may be any of the p-type impurities previously discussed. Thelightly doped source/drain regions may have a concentration ofimpurities of from about 10¹⁵ cm⁻³ to about 10¹⁹ cm⁻³. An anneal may beused to repair implant damage and to activate the implanted impurities.

In FIGS. 22A and 22B, gate spacers 86 are formed on the gate sealspacers 80 along sidewalls of the dummy gates 72 and the masks 74. Thegate spacers 86 may be formed by conformally depositing an insulatingmaterial and subsequently anisotropically etching the insulatingmaterial. The insulating material of the gate spacers 86 may be siliconoxide, silicon nitride, silicon oxynitride, silicon carbonitride, acombination thereof, or the like.

It is noted that the above disclosure generally describes a process offorming spacers and LDD regions. Other processes and sequences may beused. For example, fewer or additional spacers may be utilized,different sequence of steps may be utilized (e.g., the gate seal spacers80 may not be etched prior to forming the gate spacers 86, yielding“L-shaped” gate seal spacers, spacers may be formed and removed, and/orthe like. Furthermore, the n-type and p-type devices may be formed usinga different structures and steps. For example, LDD regions for n-typedevices may be formed prior to forming the gate seal spacers 80 whilethe LDD regions for p-type devices may be formed after forming the gateseal spacers 80.

In FIGS. 23A and 23B epitaxial source/drain regions 82 are formed in thefins 52 to exert stress in the respective channel regions 58, therebyimproving performance. The epitaxial source/drain regions 82 are formedin the fins 52 such that each dummy gate 72 is disposed betweenrespective neighboring pairs of the epitaxial source/drain regions 82.In some embodiments the epitaxial source/drain regions 82 may extendinto, and may also penetrate through, the fins 52. In some embodiments,the gate spacers 86 are used to separate the epitaxial source/drainregions 82 from the dummy gates 72 by an appropriate lateral distance sothat the epitaxial source/drain regions 82 do not short out subsequentlyformed gates of the resulting FinFETs.

The epitaxial source/drain regions 82 in the region 50N, e.g., the NMOSregion, may be formed by masking the region 50P, e.g., the PMOS region,and etching source/drain regions of the fins 52 in the region 50N toform recesses in the fins 52. Then, the epitaxial source/drain regions82 in the region 50N are epitaxially grown in the recesses. Theepitaxial source/drain regions 82 may include any acceptable material,such as appropriate for n-type FinFETs. For example, if the fin 52 issilicon, the epitaxial source/drain regions 82 in the region 50N mayinclude materials exerting a tensile strain in the channel region 58,such as silicon, silicon carbide, phosphorous doped silicon carbide,silicon phosphide, or the like. The epitaxial source/drain regions 82 inthe region 50N may have surfaces raised from respective surfaces of thefins 52 and may have facets.

The epitaxial source/drain regions 82 in the region 50P, e.g., the PMOSregion, may be formed by masking the region 50N, e.g., the NMOS region,and etching source/drain regions of the fins 52 in the region 50P areetched to form recesses in the fins 52. Then, the epitaxial source/drainregions 82 in the region 50P are epitaxially grown in the recesses. Theepitaxial source/drain regions 82 may include any acceptable material,such as appropriate for p-type FinFETs. For example, if the fin 52 issilicon, the epitaxial source/drain regions 82 in the region 50P maycomprise materials exerting a compressive strain in the channel region58, such as silicon-germanium, boron doped silicon-germanium, germanium,germanium tin, or the like. The epitaxial source/drain regions 82 in theregion 50P may also have surfaces raised from respective surfaces of thefins 52 and may have facets.

The epitaxial source/drain regions 82 and/or the fins 52 may beimplanted with dopants in a process similar to the process previouslydiscussed for forming lightly-doped source/drain regions, followed by ananneal. The epitaxial source/drain regions 82 may have an impurityconcentration of between about 10¹⁹ cm⁻³ and about 10²¹ cm⁻³. The n-typeand/or p-type impurities for epitaxial source/drain regions 82 may beany of the impurities previously discussed. In some embodiments, theepitaxial source/drain regions 82 may be in situ doped during growth.

As a result of the epitaxy processes used to form the epitaxialsource/drain regions 82 in the region 50N and the region 50P, uppersurfaces of the epitaxial source/drain regions have facets which expandlaterally outward beyond sidewalls of the fins 52. In some embodiments,these facets cause adjacent source/drain regions 82 of a same FinFET tomerge as illustrated by FIG. 23C. In other embodiments, adjacentsource/drain regions 82 remain separated after the epitaxy process iscompleted as illustrated by FIG. 23D. In the embodiments illustrated inFIGS. 23C and 23D, gate spacers 86 are formed covering a portion of thesidewalls of the fins 52 that extend above the STI regions 56 therebyblocking the epitaxial growth. In some other embodiments, the spaceretch used to form the gate spacers 86 may be adjusted to remove thespacer material to allow the epitaxially grown region to extend to thesurface of the STI region 56.

In FIGS. 24A and 24B, a first interlayer dielectric (ILD) 88 isdeposited over the structure illustrated in FIGS. 23A and 23B. The firstILD 88 may be formed of a dielectric material, and may be deposited byany suitable method, such as CVD, plasma-enhanced CVD (PECVD), or FCVD.Dielectric materials may include phosphosilicate glass (PSG),borosilicate glass (BSG), boron-doped phosphosilicate glass (BPSG),undoped silicate glass (USG), or the like. Other insulation materialsformed by any acceptable process may be used. In some embodiments, acontact etch stop layer (CESL) 87 is disposed between the first ILD 88and the epitaxial source/drain regions 82, the masks 74, and the gatespacers 86. The CESL 87 may comprise a dielectric material, such as,silicon nitride, silicon oxide, silicon oxynitride, or the like, havinga different etch rate than the material of the overlying first ILD 88.

In FIGS. 25A and 25B, a planarization process, such as a CMP, may beperformed to level the top surface of the first ILD 88 with the topsurfaces of the dummy gates 72 or the masks 74. The planarizationprocess may also remove the masks 74 on the dummy gates 72, and portionsof the gate seal spacers 80 and the gate spacers 86 along sidewalls ofthe masks 74. After the planarization process, top surfaces of the dummygates 72, the gate seal spacers 80, the gate spacers 86, and the firstILD 88 are level. Accordingly, the top surfaces of the dummy gates 72are exposed through the first ILD 88. In some embodiments, the masks 74may remain, in which case the planarization process levels the topsurface of the first ILD 88 with the top surfaces of the top surface ofthe masks 74.

In FIGS. 26A and 26B, the dummy gates 72, and the masks 74 if present,are removed in an etching step(s), so that recesses 90 are formed.Portions of the first dummy dielectric layer 60 in the recesses 90 mayalso be removed. In some embodiments, only the dummy gates 72 areremoved and the first dummy dielectric layer 60 remains and is exposedby the recesses 90. In some embodiments, the first dummy dielectriclayer 60 is removed from recesses 90 in a first region of a die (e.g., acore logic region) and remains in recesses 90 in a second region of thedie (e.g., an input/output region). In some embodiments, the dummy gates72 are removed by an anisotropic dry etch process. For example, theetching process may include a dry etch process using reaction gas(es)that selectively etch the dummy gates 72 without etching the first ILD88 or the gate spacers 86. Each recess 90 exposes and/or overlies achannel region 58 of a respective fin 52. Each channel region 58 isdisposed between neighboring pairs of the epitaxial source/drain regions82. During the removal, the first dummy dielectric layer 60 may be usedas an etch stop layer when the dummy gates 72 are etched. The firstdummy dielectric layer 60 may then be optionally removed after theremoval of the dummy gates 72.

In FIGS. 27A and 27B, gate dielectric layers 92 and gate electrodes 94are formed for replacement gates. FIG. 27C illustrates a detailed viewof region 89 of FIG. 27B. Gate dielectric layers 92 are depositedconformally in the recesses 90, such as on the top surfaces and thesidewalls of the fins 52 and on sidewalls of the gate seal spacers80/gate spacers 86. The gate dielectric layers 92 may also be formed onthe top surface of the first ILD 88. In accordance with someembodiments, the gate dielectric layers 92 comprise silicon oxide,silicon nitride, or multilayers thereof. In some embodiments, the gatedielectric layers 92 include a high-k dielectric material, and in theseembodiments, the gate dielectric layers 92 may have a k value greaterthan about 7.0, and may include a metal oxide or a silicate of hafnium,aluminum, zirconium, lanthanum, manganese, barium, titanium, lead, andcombinations thereof. The formation methods of the gate dielectriclayers 92 may include molecular-beam deposition (MBD), ALD, PECVD, andthe like. In embodiments where portions of the first dummy dielectriclayer 60 remains in the recesses 90, the gate dielectric layers 92include a material of the first dummy dielectric layer 60 (e.g., SiO₂).

The gate electrodes 94 are deposited over the gate dielectric layers 92,respectively, and fill the remaining portions of the recesses 90. Thegate electrodes 94 may include a metal-containing material such astitanium nitride, titanium oxide, tantalum nitride, tantalum carbide,cobalt, ruthenium, aluminum, tungsten, combinations thereof, ormulti-layers thereof. For example, although a single layer gateelectrode 94 is illustrated in FIG. 27B, the gate electrode 94 maycomprise any number of liner layers 94A, any number of work functiontuning layers 94B, and a fill material 94C as illustrated by FIG. 27C.After the filling of the recesses 90, a planarization process, such as aCMP, may be performed to remove the excess portions of the gatedielectric layers 92 and the material of the gate electrodes 94, whichexcess portions are over the top surface of the first ILD 88. Theremaining portions of material of the gate electrodes 94 and the gatedielectric layers 92 thus form replacement gates of the resultingFinFETs. The gate electrodes 94 and the gate dielectric layers 92 may becollectively referred to as a “gate stack.” The gate and the gate stacksmay extend along sidewalls of a channel region 58 of the fins 52.

The formation of the gate dielectric layers 92 in the region 50N and theregion 50P may occur simultaneously such that the gate dielectric layers92 in each region are formed from the same materials, and the formationof the gate electrodes 94 may occur simultaneously such that the gateelectrodes 94 in each region are formed from the same materials. In someembodiments, the gate dielectric layers 92 in each region may be formedby distinct processes, such that the gate dielectric layers 92 may bedifferent materials, and/or the gate electrodes 94 in each region may beformed by distinct processes, such that the gate electrodes 94 may bedifferent materials. Various masking steps may be used to mask andexpose appropriate regions when using distinct processes.

In FIGS. 28A and 28B, a second ILD 108 is deposited over the first ILD88. In some embodiment, the second ILD 108 is a flowable film formed bya flowable CVD method. In some embodiments, the second ILD 108 is formedof a dielectric material such as PSG, BSG, BPSG, USG, or the like, andmay be deposited by any suitable method, such as CVD and PECVD. Inaccordance with some embodiments, before the formation of the second ILD108, the gate stack (including a gate dielectric layer 92 and acorresponding overlying gate electrode 94) is recessed, so that a recessis formed directly over the gate stack and between opposing portions ofgate spacers 86, as illustrated in FIGS. 28A and 28B. A gate mask 96comprising one or more layers of dielectric material, such as siliconnitride, silicon oxynitride, or the like, is filled in the recess,followed by a planarization process to remove excess portions of thedielectric material extending over the first ILD 88. The subsequentlyformed gate contacts 110 (FIGS. 29A and 29B) penetrate through the gatemask 96 to contact the top surface of the recessed gate electrode 94.

In FIGS. 29A and 29B, gate contacts 110 and source/drain contacts 112are formed through the second ILD 108 and the first ILD 88 in accordancewith some embodiments. Openings for the source/drain contacts 112 areformed through the first ILD 88 and the second ILD 108, and openings forthe gate contact 110 are formed through the second ILD 108 and the gatemask 96. The openings may be formed using acceptable photolithographyand etching techniques. A liner, such as a diffusion barrier layer, anadhesion layer, or the like, and a conductive material are formed in theopenings. The liner may include titanium, titanium nitride, tantalum,tantalum nitride, or the like. The conductive material may be copper, acopper alloy, silver, gold, tungsten, cobalt, aluminum, nickel, or thelike. A planarization process, such as a CMP, may be performed to removeexcess material from a surface of the second ILD 108. The remainingliner and conductive material form the source/drain contacts 112 andgate contacts 110 in the openings. An anneal process may be performed toform a silicide at the interface between the epitaxial source/drainregions 82 and the source/drain contacts 112. The source/drain contacts112 are physically and electrically coupled to the epitaxialsource/drain regions 82, and the gate contacts 110 are physically andelectrically coupled to the gate electrodes 106. The source/draincontacts 112 and gate contacts 110 may be formed in different processes,or may be formed in the same process. Although shown as being formed inthe same cross-sections, it should be appreciated that each of thesource/drain contacts 112 and gate contacts 110 may be formed indifferent cross-sections, which may avoid shorting of the contacts.

Using the CMP system 200, including the CDMs, allows ions to beprevented from being deposited on, or removed from surfaces of thesubstrate 50. This ensures that humps are not formed on the surface ofthe substrate 50 after the CMP process and as such, device performanceand device yield are improved. Although the CMP system 200 has beendescribed as being used for the CMP of the sacrificial layer 68 and thesecond dummy dielectric layer 66, the CMP system 200 or a similar CMPsystem including CDMs may be used for any CMP processes used tomanufacture semiconductor devices, such as the CMP processes used toplanarize the insulation material 54, the first ILD 88, the gatedielectric layers 92 and the gate electrodes 94, and/or the second ILD108.

In accordance with an embodiment, an apparatus includes a planarizationunit for planarizing a wafer; a cleaning unit for cleaning the wafer; awafer transportation unit for transporting the wafer between theplanarization unit and the cleaning unit; and a capacitive deionizationmodule for removing ions from a solution used in at least one of theplanarization unit or the cleaning unit. In an embodiment, thecapacitive deionization module includes a first electrode and a secondelectrode, the first electrode and the second electrode being formed ofa porous material. In an embodiment, the porous material includes porouscarbon. In an embodiment, a major surface of the first electrode isseparated from a major surface of the second electrode by a distance,and the solution flows between the first electrode and the secondelectrode in a direction parallel to the major surface of the firstelectrode and the major surface of the second electrode. In anembodiment, the first electrode is in contact with the second electrode,and the solution flows through the first electrode and the secondelectrode in a direction perpendicular to a major surface of the firstelectrode and a major surface of the second electrode. In an embodiment,the capacitive deionization module operates with a constant current ofbetween 0 A and 30 A. In an embodiment, the capacitive deionizationmodule operates with a constant voltage of between 0 V and 50 V.

In accordance with another embodiment, a method includes depositing adummy gate layer on a wafer; depositing a dummy dielectric layer overthe dummy gate layer; planarizing the dummy dielectric layer using achemical mechanical planarization (CMP) process; performing a post-CMPcleaning process on the wafer; performing a drying process on the wafer;and removing ions from a CMP solution used in the CMP process, thepost-CMP cleaning process, or the drying process using a capacitivedeionization module. In an embodiment, the ions are removed from the CMPsolution by applying a voltage between a first electrode and a secondelectrode in the capacitive deionization module. In an embodiment, themethod further includes removing the ions from the capacitivedeionization module by reversing or discontinuing the voltage appliedbetween the first electrode and the second electrode. In an embodiment,the ions are removed from the CMP solution in an adsorption phase, theions are removed from the capacitive deionization module in a desorptionphase, and the method further includes monitoring electrical signals inthe first electrode and the second electrode and switching between theadsorption phase and the desorption phase based on the electricalsignals. In an embodiment, the ions are removed from the CMP solutionprior to the CMP solution coming into contact with the wafer. In anembodiment, the ions are removed from a CMP slurry used to perform theCMP process. In an embodiment, the ions are removed from a cleaningsolution used to perform the post-CMP cleaning process. In anembodiment, the ions are removed from a drying solution used to performthe drying process.

In accordance with yet another embodiment, an apparatus includes aplanarization unit for planarizing a wafer, the planarization unitincluding a high-rate platen and a buffing platen; a cleaning unit forcleaning the wafer, the cleaning unit including a tank cleaning module,a chemical mechanical cleaning (CMC) module, a brush cleaning module,and a vapor dryer module; a wafer transportation unit for transportingthe wafer between the planarization unit and the cleaning unit; and acapacitive deionization module (CDM) for removing ions from a solutionused in the planarization unit or the cleaning unit. In an embodiment,the CDM is disposed in a main tank of the tank cleaning module. In anembodiment, the CDM removes ions from a CMP slurry used in the high-rateplaten or the buffing platen. In an embodiment, the CDM removes ionsfrom a cleaning solution used in the CMC module or the brush cleaningmodule. In an embodiment, the CDM removes ions from a drying solutionused in the vapor dryer module.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. An apparatus comprising: a planarization device comprising ahigh-rate platen, a buffing platen, and a first nozzle; a cleaningdevice comprising a second nozzle and one or more wafer holders; and acapacitive deionization device comprising a first electrode and a secondelectrode, the capacitive deionization device being disposed on asurface of a polishing pad of the high-rate platen or the buffingplaten.
 2. The apparatus of claim 1, wherein the first electrode and thesecond electrode are formed of a porous material.
 3. The apparatus ofclaim 2, wherein the porous material comprises porous carbon.
 4. Theapparatus of claim 1, wherein a major surface of the first electrode isseparated from a major surface of the second electrode by a distance,wherein the capacitive deionization device is configured to remove ionsfrom a solution used in the high-rate platen or the buffing platenincluding the polishing pad, and wherein the solution flows between thefirst electrode and the second electrode in a direction parallel to themajor surface of the first electrode and the major surface of the secondelectrode.
 5. (canceled)
 6. The apparatus of claim 1, wherein thecapacitive deionization_ device operates with a constant current ofbetween 0 A and 30 A.
 7. The apparatus of claim 1, wherein thecapacitive deionization_ device operates with a constant voltage ofbetween 0 V and 50 V. 8-15. (canceled)
 16. An apparatus comprising: aplanarization device comprising a high-rate platen and a buffing platen,the high-rate platen or the buffing platen comprising a first polishingpad; a tank cleaning device comprising a main tank, an overflow tank,and a first wafer holder. a chemical mechanical cleaning (CMC) devicecomprising a buff pad, a first nozzle, and a second wafer holder; abrush cleaning device comprising a brush, a second nozzle, and a thirdwafer holder; a vapor dryer device comprising a third nozzle and afourth wafer holder; and a capacitive deionization device (CDD)comprising a first electrode and a second electrode, wherein the CDD isdisposed on a surface of the first polishing pad.
 17. The apparatus ofclaim 16, further comprising a second CDD disposed in the main tank ofthe tank cleaning device.
 18. The apparatus of claim 16, wherein the CDDremoves ions from a CMP slurry used in the high-rate platen or thebuffing platen.
 19. The apparatus of claim 16, further comprising asecond CDD disposed upstream of the first nozzle or the second nozzle,wherein the second CDD removes ions from a cleaning solution used in theCMC device or the brush cleaning_ device.
 20. The apparatus of claim 16,further comprising a second CDD disposed upstream of the third nozzle,wherein the second CDD removes ions from a drying solution used in thevapor dryer device.
 21. An apparatus comprising: a chemical mechanicalplanarization (CMP) device comprising a wafer carrier, a first nozzle,and a first polishing pad on a first platform; a cleaning devicecomprising a second nozzle and a wafer holder; a drying devicecomprising a third nozzle and a second wafer holder; and a plurality ofcapacitive deionization devices, each of the capacitive deionizationdevices comprising a first current collector and a second currentcollector, wherein a first capacitive deionization device of thecapacitive deionization devices is disposed on the first polishing pad,and wherein a second capacitive deionization device of the capacitivedeionization devices is disposed upstream of at least one of the firstnozzle, the second nozzle, or the third nozzle.
 22. (canceled)
 23. Theapparatus of claim 21, wherein the CMP device comprises a high-rateplaten and a buffing platen.
 24. The apparatus of claim 21, wherein thecleaning device further comprises: a tank cleaning device comprising amain tank, an overflow tank, and a transducer; a chemical mechanicalcleaning (CMC) device comprising a buff pad; and a brush cleaning devicecomprising one or more brushes.
 25. The apparatus of claim 21, whereineach of the capacitive deionization devices further comprises a firstelectrode and a second electrode spaced apart from the first electrode.26. The apparatus of claim 25, wherein a solution is configured to flowbetween the first electrode and the second electrode in a directionparallel to a major surface of the first electrode.
 27. The apparatus ofclaim 25, wherein each of the capacitive deionization devices isconfigured to remove ions from a solution used in the CMP device, thecleaning device, or the drying device when a voltage is applied betweenthe first electrode and the second electrode, and wherein the capacitivedeionization devices are configured to release the ions into thesolution when the voltage applied between the first electrode and thesecond electrode is reversed or discontinued.
 28. (canceled)
 29. Theapparatus of claim 1, wherein the capacitive deionization_ deviceoperates to remove ions from a solution when a voltage is appliedbetween the first electrode and the second electrode, and wherein thecapacitive deionization_ device operates to release the ions into thesolution when the voltage is discontinued.
 30. The apparatus of claim24, wherein the CMC device further comprises: a spray bar comprising aplurality of nozzles; and a rotatable swing arm, wherein the buff pad isattached to the rotatable swing arm.
 31. The apparatus of claim 30,wherein a third capacitive deionization device of the capacitivedeionization devices is disposed in the spray bar upstream of theplurality of nozzles.